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2007-05-06

IBM: Doorbraak in Chiptechnologie


Zoals in de natuur sneeuwvlokken, schelpen, koralen etc. uit zichzelf structuur opbouwen, zo worden in een nieuwe door IBM ontwikkelde techniek microprocessoren geassembleerd:

Today, chips are manufactured with copper wiring surrounded by an insulator, which involves using a mask to create circuit patterns by beaming light through the mask and later chemically removing the parts that are not needed.

The new technique to make airgaps by self-assembly skips the masking and light-etching process. Instead IBM scientists discovered the right mix of compounds, which they pour onto a silicon wafer with the wired chip patterns, then bake it.
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