LinkNotes: In Vivo Flexible Large Scale Integrated Circuits

Team develops in vivo flexible large scale integrated circuits (w/ Video)

A team led by Professor Keon Jae Lee from the Department of Materials Science and Engineering at KAIST has developed in vivo silicon-based flexible large scale integrated circuits (LSI) for bio-medical wireless communication.

Read more at: http://phys.org/news/2013-05-team-vivo-flexible-large-scale.html#jCp

A team led by Professor Keon Jae Lee from the Department of Materials Science and Engineering at KAIST has developed in vivo silicon-based flexible large scale integrated circuits (LSI) for bio-medical wireless communication.

Source: Team develops in vivo flexible large scale integrated circuits (w/ Video)

A KAIST Research Team Developed in Vivo Flexible Large Scale Integrated Circuits - Technobahn

Professor Keon Jae Lee's team fabricated radio frequency integrated circuits (RFICs) interconnected with thousand nano-transistors on silicon wafer by state-of-the-art CMOS process, and then they removed the entire bottom substrate except top 100 nm active circuit layer by wet chemical etching. The flexible RF switches for wireless communication were monolithically encapsulated with biocompatible liquid crystal polymers (LCPs) for in vivo bio-medical applications. Finally, they implanted the LCP encapsulated RFICs into live rats to demonstrate the stable operation of flexible devices under in vivo circumstances.

Professor Lee said, "This work could provide an approach to flexible LSI for an ideal artificial retina system and other bio-medical devices. Moreover, the result represents an exciting technology with the strong potential to realize fully flexible consumer electronics such as application processor (AP) for mobile operating system, high-capacity memory, and wireless communication in the near future."

Source: A KAIST Research Team Developed in Vivo Flexible Large Scale Integrated Circuits - Technobahn