Showing posts with label integrated circuits. Show all posts
Showing posts with label integrated circuits. Show all posts

2013-05-07

In Vivo Flexible Large Scale Integrated Circuits

Team develops in vivo flexible large scale integrated circuits (w/ Video)


A team led by Professor Keon Jae Lee from the Department of Materials Science and Engineering at KAIST has developed in vivo silicon-based flexible large scale integrated circuits (LSI) for bio-medical wireless communication.

Read more at: http://phys.org/news/2013-05-team-vivo-flexible-large-scale.html#jCp
A team led by Professor Keon Jae Lee from the Department of Materials Science and Engineering at KAIST has developed in vivo silicon-based flexible large scale integrated circuits (LSI) for bio-medical wireless communication.

Read more at: http://phys.org/news/2013-05-team-vivo-flexible-large-scale.html#jCp
A team led by Professor Keon Jae Lee from the Department of Materials Science and Engineering at KAIST has developed in vivo silicon-based flexible large scale integrated circuits (LSI) for bio-medical wireless communication.

Read more at: http://phys.org/news/2013-05-team-vivo-flexible-large-scale.html#jCp
A team led by Professor Keon Jae Lee from the Department of Materials Science and Engineering at KAIST has developed in vivo silicon-based flexible large scale integrated circuits (LSI) for bio-medical wireless communication.

Read more at: http://phys.org/news/2013-05-team-vivo-flexible-large-scale.html#jCp
A team led by Professor Keon Jae Lee from the Department of Materials Science and Engineering at KAIST has developed in vivo silicon-based flexible large scale integrated circuits (LSI) for bio-medical wireless communication.

A KAIST Research Team Developed in Vivo Flexible Large Scale Integrated Circuits - Technobahn

Professor Keon Jae Lee's team fabricated radio frequency integrated circuits (RFICs) interconnected with thousand nano-transistors on silicon wafer by state-of-the-art CMOS process, and then they removed the entire bottom substrate except top 100 nm active circuit layer by wet chemical etching. The flexible RF switches for wireless communication were monolithically encapsulated with biocompatible liquid crystal polymers (LCPs) for in vivo bio-medical applications. Finally, they implanted the LCP encapsulated RFICs into live rats to demonstrate the stable operation of flexible devices under in vivo circumstances.

Professor Lee said, "This work could provide an approach to flexible LSI for an ideal artificial retina system and other bio-medical devices. Moreover, the result represents an exciting technology with the strong potential to realize fully flexible consumer electronics such as application processor (AP) for mobile operating system, high-capacity memory, and wireless communication in the near future."



2008-02-10

Kovio, printing intelligence into everyday products and goods

A new technique, replacing conventional chip-making methods with printing techniques promises low-cost class of electronic paper, displays, labels, RFID tags, sensors, smart cards and perhaps even programmable wallpaper.
The Wall Street Journal Home Page
Kovio, whose backers include widely known venture capitalist Vinod Khosla, says it has developed a kind of silicon ink that can be sprayed on flexible surfaces using commercial printing systems. Where some companies have developed circuit-printing approaches with various organic and inorganic materials, Kovio says it has used its silicon-based process to build unusually fast devices called thin-filmed transistors.
[ The Wall Street Journal ]
Kovio
Inventing breakthrough printed silicon technologies and complete printed system solutions that build intelligence into everyday products and goods, thereby profoundly improving the productivity and profitability of industries including retail, pharmaceutical, consumer electronics, transportation, manufacturing and energy.

Vinod Khosla
:

"Kovio is introducing one of the most disruptive technologies that the electronics and printing markets have seen to date. Its technology offers dramatic cost, resource and energy advantages over traditional silicon. Now for the first time, it is economically feasible to embed intelligence in everyday products thereby transforming the consumer experience."

Technology

Why Print?

Printed silicon electronics combines the intelligence and functionality of silicon semiconductors and the low-cost manufacturing paradigm of graphics printing. Instead of using conventional color inks to print magazines, books and newspapers, this new paradigm uses silicon-based inks to print integrated circuits, sensors and displays. This revolutionary technology brings the value proposition of silicon-based integrated circuits to industries that have until now not been enable to embed integrated circuits in their products.

transbaked
All Printed Silicon TFT

[ Kovio ]


Related:
kovio
Technology Review: Printing Cheap Chips
071123: Printed silicon RF-IDs by Kovio
Log on in EE Times-Asia, keeping ahead of the curve of electronics design
EETimes.com - Printed ICs aim to make mark on mainstream

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